Homogeneous/Heterogeneous Metal Bonding

同类/异类金属键合

It bonds heterogeneous metals well, which was hard to achieve with conventional bonding method. Needless to solder, you can bond them directly at room temperature

能够在室温下直接键合异类金属，这是传统焊接方法难以实现的。

Infrared Image Sensor (Cool Bond)

红外图像传感器 (Cool Bond)

Our ultrasonic bonding machine bonds 300,000 sharp-end bumps (Kyushu U) at once at room temperature, a collaboration with Kyushu University

同Kyushu大学技术合作，我们的超声波焊接机可在室温下一次性键合30万个尖锐的端部凸起。