Homogeneous/Heterogeneous Metal Bonding

同类/异类金属键合

It bonds heterogeneous metals well, which was hard to achieve with conventional bonding method. Needless to solder, you can bond them directly at room temperature

它可在室温下直接键合异类金属，这是传统焊接方法难以实现的。

IGBT Module (Ribbon Bonding)

IGBT 模块 (Ribbon Bonding)

Multiple kinds of ribbon bondings are available with multi-feeder

多喂料器可实现多种带状键合

ABB Process

Cu ribbon bonding is available by using Al as a buffer material, it gives strength to a feeble base material

使用铝作为缓冲材料可以实现铜带状键合, 可以提高薄弱基础材料的强度