富藤科技产品信息

产品名称:IGBT Ultrasonic Metal Bonding Machine

产品类别:Ultrasonic Bonding Machine

IGBT Ultrasonic Metal Bonding Machine(Ultrasonic metal bonder)

IGBT Ultrasonic Metal Bonding Machine(Ultrasonic metal bonder)


IGBT超声波金属键合机(超声波金属键合机))

Ultrasonic bonding system which is appropriate for producing power device

适用于功率模块生产的超声波键合系统

  • Flexible manufacturing
  • 柔性制造
  • Resistant to terminal floating
  • 抗终端浮动
  • Color image processing
  • 彩色图像处理

Homogeneous/Heterogeneous Metal Bonding

Homogeneous/Heterogeneous Metal Bonding

同类/异类金属键合

It bonds heterogeneous metals well, which was hard to achieve with conventional bonding method. Needless to solder, you can bond them directly at room temperature

它可在室温下直接键合异质金属,这是传统焊接方法难以实现的。

IGBT Module (Terminal bonding)

IGBT Module (Terminal bonding)

IGBT模块(终端连接)

It is desirable to bond without soldering when dealing with IGBT module, which requires high temperature during operation. Ultrasonic bonds the lead on the package side and the electrode on the DBC substrate directly

在处理IGBT模块时,无需传统的高温焊接。超声波将封装侧导线和DBC基板上电极直接键合

Copyright © 2009 版权所有 上海富藤机械科技有限公司 · 沪ICP备10017960号

上海公安备案

沪公网安备 31011502003961号

藤仓气缸,日本藤仓气缸,低摩擦气缸,Fujikura气缸,韩国SEBA,SEBA流量计,SEBA阀门,精密减压阀,电空变换器
点击关闭